<ol>
<li>4-38 layers
</li>
<li>Board finished thickness: 0.3mm-7.0mm
</li>
<li>Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen Free, Rogers, Telfon.
</li>
<li>Max. Finished board size: 23*25(580*900mm)
</li>
<li>Min. Drilled hole size: 6mil(0.15mm)
</li>
<li>Min. Line width: 3mil(0.075mm), Min. Line spacing: 3mil(0.075mm)
</li>
<li>Surface finish/treatment: HASL/HASL lead free, Chemical tin, ENIG,Immersion Silver, OSP, etc.
</li>
<li>Copper thickness: 0.5-20 oz
</li>
<li>Solder mask color: Green/yellow/black/white/red/blue
</li>
<li>Copper thickness in hole: &gt;25.0 um(&gt;1mil)
</li>
</ol>

1. 4-38 layers
    
2. Board finished thickness: 0.3mm-7.0mm
    
3. Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen Free, Rogers, Telfon.
    
4. Max. Finished board size: 23\*25(580\*900mm)
    
5. Min. Drilled hole size: 6mil(0.15mm)
    
6. Min. Line width: 3mil(0.075mm), Min. Line spacing: 3mil(0.075mm)
    
7. Surface finish/treatment: HASL/HASL lead free, Chemical tin, ENIG,Immersion Silver, OSP, etc.
    
8. Copper thickness: 0.5-20 oz
    
9. Solder mask color: Green/yellow/black/white/red/blue
    
10. Copper thickness in hole: &gt;25.0 um(&gt;1mil)

General specification of Hitech multi-layer printed circuit board